Vacuum Thin Flim Deposition 400 series
Vacuum coating, as an important process in industries such as semiconductors, displays, and photovoltaics, plays a crucial role in the final performance of devices and modules. Under high vacuum conditions, methods such as thermal evaporation or magnetron sputtering are used to deposit high-purity metals, compound functional layers, and other coating materials onto the surface of the substrate with ultra-high precision, at a rate as low as 0.1nm/s. The deposition is done uniformly and densely, and the thickness is precisely controlled. By combining different types of film layers, specific functions of devices can be achieved, such as photovoltaic power generation, electroluminescence, and transistor amplification.
A vacuum coating machine generally uses a mechanical pump as the primary pump to evacuate the coating chamber to below 0.1 Torr. Then, a diffusion pump or molecular pump is used as the secondary pump to further evacuate the coating chamber to below 0.00001 Torr. A pressure of 10-5 Torr is typically sufficient for the coating requirements of common metals and functional materials.
In the thermal evaporation method of the deposition process, a solid metal or functional material in an evaporation boat, such as tungsten or molybdenum boat, is heated by applying a high current. Through the thermal effect in a high-temperature, high-vacuum environment, the material undergoes sublimation and diffuses onto the surface of the substrate. In some processes, the temperature of the substrate is also controlled to enhance the deposition effect.
In the magnetron sputtering method of the coating process, a plasma is generated under high pressure, typically using argon plasma, through magnetic field confinement. The plasma bombards the target material, causing its molecular ejection, which then deposits onto the surface of the substrate. In some processes, the temperature of the substrate is also controlled to enhance the deposition effect.
Our company's D400/M400 product features a compact structure, small footprint, high integration, and intelligent touchscreen control. It enables precision coating under high vacuum conditions and incorporates a real-time film thickness monitoring system and an evaporation rate control system. It can achieve precise coating control at a rate of 0.1nm/s, making it the best choice for high-end intelligent manufacturing and research fields.
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Reliable constant current. By employing feedback loop control, the evaporation current is maintained constant. The maximum current in the standard configuration can reach up to 100A, with an optional upgrade to 150A.
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Integrated touchscreen control. All valves are intelligently controlled, allowing for the opening or closing of high vacuum electromagnetic valves, high vacuum butterfly valves, mechanical pumps, molecular pumps, diffusion pumps, cooling water, and other components through the touchscreen interface.
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Compact structure and small footprint. All vacuum pumps are integrated within the equipment, eliminating the need for external pneumatic and cooling devices.
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High-precision monitoring of film thickness deposition rate. The film thickness deposition rate can be accurately controlled to 0.1nm/s. By utilizing the piezoelectric effect of crystal oscillators, the resonance frequency is precisely determined, enabling the calculation of the material's deposition rate and ensuring high-quality film formation.
Custom feedback:
Using the D400 system, it is possible to achieve dense, mirror-like coatings with precise control of the evaporation rate when depositing common metals such as gold, silver, and aluminum on glass substrates.
