The S400 vacuum magnetron sputtering machine is a compact system with a spacious chamber and a small footprint. It can coat substrates with a maximum diameter of 350mm. The standard configuration includes two circular targets (50mm diameter, 5mm thickness each), and it also features two expandable CF35 interfaces for additional customization of sputtering positions. The maximum sputtering power can reach 1 kW, using a DC power supply and an RF power supply.

Upon startup, the vacuum pumping speed reaches 10-3 Pa within 10 minutes. The thickness detection accuracy is as fine as 0.01 nm, and the sputtering rate can be precisely controlled to below 0.1 nm/s. The uniformity of film thickness is less than 3% across a 100x100mm area.