The M400S dual-function vacuum deposition machine combines thermal evaporation and magnetron sputtering capabilities in a compact design with ample chamber space and a small footprint. It accommodates substrates up to 350mm in diameter. The standard configuration includes three thermal evaporation positions and one circular target (50mm diameter, 5mm thickness), along with three expandable CF35 interfaces for further customization of coating positions. The maximum sputtering power can reach 1 kW, utilizing a default DC power supply that can be optionally switched to an RF power supply.

Upon startup, the vacuum pumping speed achieves 10-3 Pa within 10 minutes. The thickness detection accuracy is as fine as 0.01 nm, and the deposition rate can be precisely controlled to below 0.1 nm/s. The uniformity of film thickness is less than 3% across a 100x100mm area.